Indlela Ukunyamezelana Kwepitch Yesixhumi sePCB Okuyichaphazela Ngayo Intembeko Yesignali Kwizicelo Eziphezulu Zokusebenzisa Ubuninzi
TL;DR — Izinto ezibalulekileyo ekufuneka ziqwalaselwe
- Ukunyamezelana kwesandi sokudibanisa kumisela ngokuthe ngqo ukuthembeka kwesignali kwiifrequensi eziphezulu. Ukuphambuka kwe +/-0.05mm kunokutshintsha uthintelo olubonakalayo nge-5-12 ohms, okubangela iimpazamo zokubonakaliswa kwesignali okulinganisekayo kunye nedatha.
- Kwizicelo ezingaphezulu kwe-1 GHz, chaza ukunyamezela kwepitch ye-+/-0.05mm okanye ngaphezulu. Izihlanganisi eziqhelekileyo zokunyamezela ze-+/-0.1mm zinqunyelwe ekusebenzeni kwe-sub-500 MHz.
- Ukukhetha izinto kubalulekile: Ii-dielectric ze-LCP zandisa imida yefrikhwensi esebenzisekayo nge-30-50% ngaphaya kwezihlanganisi ze-PA66/PA6T eziqhelekileyo kwi-pitch efanayo.
- Uthotho lwe-NBJGE IC Socket lubonelela ngeendidi ezintathu zepitch (1.27mm, 2.0mm, 2.54mm) ezinokunyamezelana ngokuchanekileyo konxibelelwano, ulawulo lwemizi-mveliso, kunye nezicelo zeRF.
Ukunyamezelana kwephimbo lesixhumi se-PCB yenye yezona parameter zinganakwayo kodwa ezibalulekileyo ezimisela ukuthembeka kwesignali kwiinkqubo ze-elektroniki ezisebenzisa i-frequency ephezulu. Xa amaxesha okunyuka kwesignali esondela kwi-nanosecond e-1 okanye ngaphantsi, ubukhulu bomzimba be-connector interface buqala ukulawula indlela esebenza ngayo umbane. Iinjineli zoyilo zikhetha izihlanganisi zonxibelelwano iziseko zophuhliso, iinkqubo zolawulo lwemizi-mveliso, okanye iimodyuli zeRF azinakuyiphatha into yokunyamezela isandi njengengcaciso yesibini.
Kuba nokuba ukuphambuka okubonakala kuncinci kwisithuba sokunxibelelana kudala ukungahambelani kwe-impedance okubonisa amandla abuyela kumthombo endaweni yokuwahambisa ngokucocekileyo kumthwalo. Kwinkqubo ye-50 ohm esebenza kwi-2.4 GHz, inyathelo le-impedance elibangelwa kukunyamezelana kwephitshi le-10 ohms kuphela linokuvelisa i-voltage standing wave ratio (VSWR) edlula i-1.5:1, nto leyo ekhokelela ekulahlekelweni kwamandla yi-4% ehlangana kwiindawo ezininzi zokudibanisa.
Ukuqonda i-PCB Connector Pitch kunye nendima yayo ekudlulisweni kwesignali
Iphimbo lokudibanisa — i umgama ophakathi ukuya embindini phakathi kwee-contacts ezikufutshane kwi-PCB connector okanye kwi-IC socket — ichaza ijometri esisiseko yendlela yokudlulisela. Olu bukhulu, ludibene neempawu zezinto ze-dielectric kunye ne-contact geometry, luseka i-characteristic impedance (Z0) efunyanwa sisignali njengoko sihamba kwi-connector.
Kuyilo lwe-PCB olusebenzisa amaxesha amaninzi, injongo kukugcina uthintelo oluhambelanayo kuyo yonke indlela yesiginali ukusuka kumqhubi ukuya kwi-receiver. Naluphi na utshintsho olukhawulezileyo kwi-impedance ludala ukubonakaliswa okungaphelelanga. Amandla abonakalisiweyo athabatha kwisignali ehamba phambili, enciphisa ubukhulu kwi-receiver kwaye anokubangela iimpazamo zeebhithi kwiinkqubo zedijithali.
Ubudlelwane phakathi kwepitch yesixhumi kunye ne-impedance bulandela ithiyori yomgca wokudlulisa osele umiselwe kakuhle. Ipitch ebanzi ngokubanzi ivelisa i-impedance ephezulu kwi-contact geometry ethile, ngelixa i-pitch encinci inciphisa i-impedance ngokwandisa i-capacitive coupling phakathi kwee-conductors ezikufutshane.
Kutheni Ukunyamezelana Kwepitshi KuyiParamitha Ebalulekileyo — Akusiyo Pitshi Nje
Amaxabiso e-nominal pitch (2.54mm, 2.0mm, 1.27mm) abonelela nge-geometry ekujoliswe kuyo, kodwa ukunyamezelana kokuvelisa kumisela ukuba loo geometry igcinwa njani rhoqo kuyo yonke imithamo yemveliso. Isixhumi esichazwe kwi-pitch ye-2.54mm kodwa esenziwe ngokunyamezela kwe-+/-0.15mm siya kubonisa umahluko omkhulu kwi-impedance ukusuka kwi-pin ukuya kwi-pin kunye ne-batch ukuya kwi-batch.
Ngenxa yokuba i-impedance ilingana ngokuphambeneyo nesithuba esiphakathi kwesignali kunye nabaqhubi bokubuyisela, i-+/-0.1mm yokutshintsha kwephimbo inokuvelisa i-impedance yokutshintsha ukusuka kwi-+/-4 ukuya kwi-+/-8 ohms kulungiselelo oluqhelekileyo lwe-50 ohm microstrip. Xa olu tshintsho lufikelela kwi-+/-12 ohms okanye ngaphezulu — oluqheleke kakhulu kwizixhumi zexabiso eliphantsi — ukungaqhubeki kwe-impedance kuba nzima ngokwaneleyo ukwehlisa umgangatho wesignali nokuba kumaza aphakathi.
| Ukunyamezelana (+/-mm) | Utshintsho lwe-Impedance (+/-ohms) | Ubuninzi beFreq eSebenzayo (GHz) | Isicelo esiqhelekileyo |
|---|---|---|---|
| +/-0.15 | 8-12 | 0.3 | Izixhumi zamandla ze-I/O ezinesantya esiphantsi |
| +/-0.10 | 5-8 | 0.8 | Isignali yenjongo ngokubanzi, ulawulo lwemizi-mveliso |
| +/-0.05 | 3-5 | 3.0 | I-Gigabit Ethernet, amakhadi emigca ye-telecom |
| +/-0.03 | 1-3 | 10.0 | Iimodyuli zeRF, iziseko zophuhliso ze-5G |
Yingakho ukucacisa ukunyamezelana kwesandi kwahlula iindlela ezinzulu zoyilo oluphezulu kakhulu kwiindlela zokuzonwabisa. Udidi lokunyamezelana lwe-+/-0.05mm olufumaneka kwiisokethi ze-NBJGE precision IC lumele umda osebenzayo wokusebenza okuthembekileyo ngaphezulu kwe-1 GHz.
Uthelekiso lwePitch yeSocket ye-IC: 1.27mm vs 2.0mm vs 2.54mm
Umgca wemveliso ye-IC socket ye-NBJGE ugubungela iintlobo ezintathu zepitch ezisemgangathweni, nganye ilungiselelwe iidomeyini ezahlukeneyo zesicelo esisebenza rhoqo. Ngokusekelwe kumlinganiselo we-TDR wefektri owenziwe kwi-Q1 2026 kwiisampulu ezingaphezu kwama-200, olu thelekiso lulandelayo lubonisa iiparameter zokuthembeka kwesignali ezilinganisiweyo kwiklasi nganye yepitch.
| Ipharamitha | Iphimbo le-1.27mm | Iphimbo le-2.0mm | Iphimbo le-2.54mm |
|---|---|---|---|
| Ukunyamezelana Okuqhelekileyo | +/-0.05mm | +/-0.05mm | +/-0.10mm (std) / +/-0.05mm (iprimiyamu) |
| Ukuphazamiseka kwempawu | 42+/-5 ohms | 48+/-4 ohms | 52+/-5 ohms |
| Ukulahleka Kokufakwa (kwi-3 GHz) | -0.8 dB | -0.6 dB | -0.5 dB |
| I-Crosstalk (kwi-2 GHz, iiphini ezikufutshane) | -22 dB | -28 dB | -32 dB |
| I-Bandwidth Esebenzisekayo (-3 dB) | 2.5 GHz | 4.0 GHz | 5.5 GHz |
| Ubuninzi bePin (iipins nge-cm2 nganye) | 62 | 25 | 15 |
| Isicelo esiBalaseleyo | Ibhasi yedijithali enoxinano olukhulu | Iinkqubo zemiqondiso exutyiweyo | I-RF / i-analog ye-frequency ephezulu |
Imilinganiselo yethu ityhila urhwebo olucacileyo: iphimbo elincinci linika uxinano oluphezulu lwephini kodwa lizisa i-crosstalk ephezulu kunye ne-impedance ephantsi, zombini ezo zinto zinciphisa ukusebenza kwe-high-frequency. Uhlobo lwe-2.54mm pitch, olune-crosstalk yalo esezantsi (-32 dB vs -22 dB kwi-1.27mm) kwaye luhambelana kakhulu ne-50 ohm system impedance, luhlala luphumelela ngakumbi kwizihlanganisi ze-finer-pitch kwizicelo ze-analog RF ezingaphezulu kwe-1 GHz.
Le yingcaciso ebalulekileyo kwiinjineli zoyilo: xa ukuthembeka kwesignali kubaluleke kakhulu, musa ukutshintshela kwi-pitch encinci ekhoyo ukuze wonge indawo. I-socket ye-IC yepitch ye-2.54mm ihlala ilukhetho olukhethwayo kwii-RF ezininzi kunye nee-interfaces zonxibelelwano ukuya kuthi ga kwi-5 GHz.
Indlela Ukunyamezelana Kwemveliso Okudala Ngayo Ukungavisisani Kwe-Impedance
Izinto ezintathu ezithile zokuvelisa ziguqulela ukunyamezela isandi ekubeni kukuwohloka kwesignali okunokulinganiswa: impazamo yokubeka indawo yoqhagamshelwano, umahluko wobukhulu be-insulator, kunye nokungalingani kobukhulu beplati.
Indlela yesizathu #1: Ngenxa yokuba impazamo yokubeka unxibelelwano ngexesha lenkqubo yokubumba kunye nokufaka idala isithuba esingalinganiyo phakathi konxibelelwano lwesignali olukufutshane, ubude be-capacitance ngeyunithi nganye buyatshintsha ukusuka kwi-pin ukuya kwi-pin. Olu tshintsho lwe-capacitance olukwindawo luvelisa ukuguquguquka kwe-impedance ehambelanayo kwindawo nganye yojongano. Kwi-2.4 GHz, impazamo ye-pitch ye-0.08mm phakathi kwee-pin ezimbini ezikufutshane idala utshintsho lwe-capacitance olumalunga ne-0.15 pF, oluthi kwinkqubo ye-50 ohm luhambelane nenyathelo le-impedance ye-7 ohms.
Indlela yesizathu #2: Ngenxa yokuba izinto zokuhlala ze-insulator (ngesiqhelo i-PA66, i-PA6T, okanye i-LCP) ziyancipha nge-0.2-1.5% ngexesha lenkqubo yokupholisa i-injection molding, isithuba soqhagamshelwano emva kokupholisa sahlukile kuyilo lwe-mold cavity. I-2.54mm pitch connector ebunjwe kwi-PA6T enokuncipha kwe-0.6% mold ifumana ukunciphisa kwe-pitch okuphakathi kwe-0.015mm. Xa zidityaniswe nokuguguleka kwezixhobo, ukutshintsha kobushushu, kunye nokutshintsha kwe-material batch, ukunyamezelana okuqokelelweyo kunokufikelela kwi-0.10-0.15mm.
Indlela yesizathu #3: Ngenxa yokuba ukhetha iplanga yegolide (ngesiqhelo yi-0.76-1.27 um phezu kwesithintelo se-nickel) songeza i-15-25 um yezixhobo ngomphezulu woqhagamshelwano, utshintsho kubukhulu beplati kulo lonke i-connector strip ludala utshintsho oluncinci kodwa olulinganisekayo lwepitch. Imigca yeplatingi ekhethiweyo ngesantya esiphezulu enokubeka iliso lobukhulu be-XRF ngexesha langempela igcina olu tshintsho kwi-+/-3 um, ngelixa iinkqubo ezisemgangathweni zinokuvumela i-+/-8 um.
Indima yeDielectric Material kwi-High-Frequency Performance
Izinto zokukhusela ezijikeleze izihlanganisi zePCB zinempembelelo enkulu ekugqibeleleni kwesignali — nangaphezulu kokunyamezela isandi kwezinye iimeko. I-dielectric constant (Dk) kunye ne-dissipation factor (Df) yezinto ezihlala kuzo zimisela indlela esebenza ngayo intsimi ye-electromagnetic kwi-interface yesixhumi.
| Izinto eziphathekayo | I-Dk kwi-1 GHz | I-Df kwi-1 GHz | Ubushushu obuphezulu (C) | Ixabiso elihambelanayo |
|---|---|---|---|---|
| I-PA66 (inayiloni eqhelekileyo) | 3.5-4.0 | 0.020-0.030 | 120 | 1.0x |
| I-PA6T (inayiloni enobushushu obuphezulu) | 3.3-3.8 | 0.010-0.018 | 180 | 1.4x |
| I-PPS (i-polyphenylene sulfide) | 3.0-3.5 | 0.004-0.008 | 220 | 1.8x |
| I-LCP (i-polymer yekristale engamanzi) | 2.8-3.3 | 0.002-0.005 | 260 | 2.5x |
Ii-dielectric ze-LCP Yandisa uluhlu lweefrikhwensi ezisebenzisekayo zoyilo oluthile lwepitch nge-30-50% xa kuthelekiswa nee-housings ze-PA66 eziqhelekileyo, ngokuyintloko ngenxa ye-LCP's low and stability dielectric constant kunye ne-dissipation factor ephantsi kakhulu. Kwisokethi ye-IC yepitch ye-2.54mm esebenza kwi-3.5 GHz, i-LCP housing inciphisa ilahleko yokufakelwa ukusuka kwi--0.9 dB ukuya kwi--0.5 dB — uphuculo lwe-44%.
I-NBJGE inikezela ngeendlela ze-dielectric ze-LCP kunye ne-PPS kulo lonke uluhlu lwemveliso yayo ye-IC socket kubathengi abafuna ukuthembeka okuphezulu kwesignali kumaza angaphezulu kwe-2 GHz.
Ukonakala koBulungisa beSignali: Ukusuka kwiThiyori ukuya kwiMpembelelo eLinganisekayo
Ukuwohloka kwesignali okubangelwa kukunyamezelana kwepitch kubonakala ngeendlela ezintathu ezilinganiswayo: ukwanda kwelahleko yokubuya, i-crosstalk ephezulu, kunye nokuqokelelwa kwe-jitter kwimithombo yedatha yedijithali.
Ukulahleka kokubuya — okulinganiswe njenge-S11 kwi-dB — kulinganisa ukuba ingakanani imiqondiso yesiganeko eboniswa ngasemva ngenxa yokungafani kwe-impedance. Kwisixhumi esisebenza kwi-3 GHz esinokunyamezelana kwe-+/-0.10mm, iindlela eziqhelekileyo zokulahlekelwa yimbuyekezo -12 ukuya kwi--15 dB, oko kuthetha ukuba i-3-6% yamandla esignali iyabonakaliswa. Ukuphucula ukunyamezelana ukuya kwi-+/-0.05mm kuphucula ukulahleka kwembuyekezo ukuya kwi--18 ukuya kwi--22 dB, kunciphisa amandla abonakalisiweyo ukuya kwi-0.6-1.5%.
I-Crosstalk — elinganiswa njenge-S21 (kufutshane) okanye i-S31 (kude) — ilinganisa ukudibana okungafunekiyo phakathi kweendlela zesignali ezikufutshane. Kwi-2 GHz, isixhumi sepitch esingu-1.27mm sibonisa malunga ne-10 dB engaphezulu kunesixhumi sepitch esingu-2.54mm kwisimo esifanayo.
Ukuqokelelwa kwe-jitter — utshintsho lwexesha lotshintsho lwesignali yedijithali — mhlawumbi yeyona mpembelelo ibalulekileyo ekusebenzeni kuba inciphisa ngokuthe ngqo umda wexesha kwiireceiver zedijithali. Ukungafani kwe-impedance ebangelwa yi-connector ye-10 ohms kwisantya sedatha se-1.25 Gbps kudala malunga ne-25-40 ps ye-deterministic jitter. Xa kukho ii-interfaces ezintathu okanye ezine ze-connector kwindlela yesignali, i-jitter eqokelelweyo ingadla i-30-50% yebhajethi yexesha leyunithi ekhoyo.
Izikhokelo Zokukhetha Ezisebenzayo ZeeNjineli Zoyilo
Khetha i-PCB connector pitch yakho kunye neklasi yokunyamezelana ngokusekelwe kwi-operating frequency kuqala, uze emva koko ucinezelo lwe-pin kunye nexabiso.
Kwizicelo ze-DC ukuya kwi-500 MHz
Ipitshi eqhelekileyo eyi-2.54mm enokunyamezelana kwe-+/-0.10mm yanele. Ii-dielectric ze-PA66 okanye ze-PA6T zibonelela ngokusebenza okwaneleyo. Usetyenziso oluqhelekileyo luquka imiqondiso yokulawula umbane, i-interfaces ye-sensor yemizi-mveliso, kunye nokufunyanwa kwedatha ngesantya esiphantsi.
Kwii-Applications ze-500 MHz ukuya kwi-3 GHz
Khetha i-pitch ye-2.54mm okanye ye-2.0mm ene-+/-0.05mm tolerance kunye ne-PA6T okanye i-PPS dielectric. Cacisa i-impedance elawulwayo (50 ohms +/-5 ohms) kwaye ucele idatha yovavanyo lwe-TDR yasefektri. Olu luhlu lugubungela i-Gigabit Ethernet, iimodyuli ze-WiFi 5/6 front-end, kunye ne-4G LTE infrastructure.
Kwii-Applications ze-3 GHz ukuya kwi-10 GHz
Sebenzisa i-pitch eyi-2.54mm ene-+/-0.03mm tolerance kunye ne-LCP dielectric. Cela ukuchazwa kweparameter epheleleyo ye-S ukuya kuthi ga kwi-10 GHz. Oku kuquka ii-receiver zesathelayithi ze-5G NR sub-6 GHz kunye ne-Ku-band. I-NBJGE ifikelela kwi-+/-0.03mm ngokusetyenziswa kwezixhobo zokubumba ngokuchanekileyo kunye nokuzinzisa ubushushu bezixhobo iiyure ezingama-48 ngexesha lokwenziwa kwemveliso.
Ngaphezulu kwe-10 GHz
Cinga ngezisombululo zesixhumi ezenziwe ngokwezifiso ezineeplani zomhlaba ezifakwe ngaphakathi. Iisokhethi ze-IC eziqhelekileyo azikhuthazwa ukuba zibe ngaphezulu kwe-10 GHz ngaphandle kokulinganisa okubanzi kwe-SI. Nxibelelana neqela lethu lobunjineli ukuze ufumane iingcebiso ezithile malunga nesicelo.
Iindlela zoVavanyo kunye noQinisekiso
I-TDR (i-reflectometry yexesha-domain) yindlela ephambili yokuvavanya ukuqinisekisa iprofayili ye-impedance yesixhumi phantsi kweemeko zokusebenza zokwenyani. Isixhobo se-TDR sithumela i-pulse yenyathelo elikhawulezayo (ngesiqhelo ixesha lokunyuka kwe-35 ps, elihambelana ne-bandwidth ye-10 GHz) kwaye silinganisa ukubonakaliswa. Ukungaqhubeki kwe-impedance nganye kubonakala njengokunyuka kwi-TDR waveform.
Umlinganiselo we-S-parameter ye-VNA (vector network analyzer) ubonelela ngophawu lwe-frequency-domain olufunekayo ukuze kulinganiswe uyilo. Ngokwe I-IEC 60512-27-100, Ukulinganiswa kwe-S-parameter yezihlanganisi ze-PCB kufuneka kwenziwe ubuncinane ngaphezulu kwe-5x yesantya esiphezulu sokusebenza.
Uhlalutyo lwedayagramu yamehlo yeyona ndlela ibonakalayo yokuvavanya umgangatho wesignali yedijithali ngesixhobo sokudibanisa. Kwisokethi ye-NBJGE IC ye-pitch ye-2.54mm enokunyamezelana kwe-+/-0.05mm, uvavanyo lwasefektri kwi-2.5 Gbps lubonisa ukuvuleka kwamehlo ngokuthe nkqo kwe-320 mV (68% ye-amplitude yomqhubi) kunye ne-horizontal jitter ye-22 ps peak-to-peak.
Uthelekiso loKhuphiswano: Imigangatho ye-NBJGE vs Industry
Ngenxa yokuba ayizizo zonke iisokhethi ze-IC "ezichanekileyo" ezibonelela ngentsebenzo efanayo yokunyamezelana, sithelekise ngokuthe ngqo iindidi ezintathu zabathengisi kwi-pitch ye-2.54mm sisebenzisa idatha yovavanyo lwasefektri evela kwiisampulu ezingama-50.
| Ipharamitha | Ubuchule be-NBJGE | Umgangatho weShishini | Ibanga loHlahlo-lwabiwo mali |
|---|---|---|---|
| Ukunyamezelana Okulinganiselweyo (ii-sigma ezi-6) | +/-0.05mm | +/-0.10mm | +/-0.15mm |
| Impedance ye-TDR (ithagethi ye-50 ohm) | 52+/-4 ohms | 49+/-8 ohms | 50+/-12 ohms |
| Ukulahleka Kokufakwa kwi-3 GHz | -0.5 dB | -0.8 dB | -1.4 dB |
| Ukulahleka kokubuya kwi-3 GHz | -20 dB | -14 dB | -9 dB |
| Igolide Plating Ubuncinci Ubungqingqwa | 0.76 inye | 0.50 inye | 0.25 inye |
| Isalathiso sexabiso | 1.0x | 0.7x | 0.4x |
Isiphelo kunye namanyathelo alandelayo
Ukunyamezelana kwephimbo lesixhumi se-PCB yiparameter yoyilo lwe-oda yokuqala yokuthembeka kwesignali ye-frequency ephezulu, hayi inkcazo yesibini yokuvelisa. Umahluko phakathi kokunyamezelana kwe-+/-0.10mm kunye ne-+/-0.05mm kunokuthetha umahluko phakathi komzobo weliso odlulayo nongaphumeleliyo kwi-3 GHz, nto leyo eguqulela ngokuthe ngqo kukuthembeka kwentsimi yezixhobo zonxibelelwano kunye nezixhobo zolawulo lwemizi-mveliso.
Xa uvavanya ababoneleli besixhumi se-PCB kuyilo lwakho olulandelayo olusebenzisa i-high-frequency, cela idatha ethile yokunyamezelana enemilinganiselo ye-TDR impedance endaweni yokuxhomekeka kwiinkcukacha zepitch ezimiselweyo kuphela.
I-NBJGE ibonelela ngeengxelo zovavanyo lokuthembeka kwesignali ezineenkcukacha ngekhithi nganye yesampulu yesokhethi ye-IC, kuquka iiprofayili ze-impedance ye-TDR kunye nedatha ye-S-parameter ukuya kuthi ga kwi-10 GHz.
Ngaba ufuna iiSockets ze-IC ezichanekileyo ukuze uYilo lwakho oluQhelekileyo?
Cela ikhithi yesampulu yasimahla ngedatha epheleleyo yovavanyo lokuthembeka kwesignali.
Ndwendwela: Umgca weMveliso yeSokhethi ye-NBJGE IC
I-imeyile: sara@nbjguang.com | Umnxeba: +86-15957487380
Imibuzo ebuzwa qho
Ndingayisebenzisa i-1.27mm pitch connector kwi-5G applications?
Ewe, kodwa ngokucingisisa ngobuchule ngoyilo. Isixhumi sepitch esingu-1.27mm singasetyenziselwa i-5G NR sub-6 GHz ukuba uyilo luquka ukhuselo lomhlaba kwaye i-frequency ihlala ingaphantsi kwe-3 GHz. Ngaphezulu kwe-3 GHz, i-crosstalk ephezulu (-22 dB) kunye ne-impedance ephantsi (42 ohms) zinokubangela ukonakala kwesignali okungamkelekanga.
Ndifanele ndiqinisekise kangaphi ukuba isandi se-connector siyanyamezelana xa sisebenza?
Ukuhlolwa komgangatho wabathengisi kufuneka kuquke ukulinganiswa kwepitch rhoqo kwiinyanga ezi-6. Ngokwe I-ISO 9001 Iimfuno, cela idatha yokulinganisa i-AOI kwiinyanga ezili-12 zokugqibela zemveliso enamaxabiso e-Cpk angaphezu kwe-1.33.
Ngaba utshintsho lobushushu luchaphazela ukunyamezela isandi?
Ewe, ukwandiswa kobushushu kuchaphazela iphimbo lesixhumi xa sisebenza. Isixhumi se-LCP se-pitch esingu-2.54mm (i-CTE ye-5-10 ppm/C) sanda malunga ne-0.0013mm ngokunyuka kwe-10 C. Ukwandiswa okuqokelelweyo kwisixhumi se-64-pin kunokufikelela kwi-0.08mm kumahluko wobushushu obungu-50 C. Kwizicelo zobubanzi bobushushu, chaza izinto ezihambelana ne-CTE.
Iireferensi: I-ISO 9001:2015 | I-IEC 60512-27-100 | Imigangatho yoBulungisa beSignali ye-IEEE
Ukuhlaziywa kokugqibela: Meyi 21, 2026. Idatha esekwe kwimilinganiselo yefektri yekota yokuqala ka-2026 evela kwiisampulu zesokhethi ze-IC ezingaphezu kwama-200 kwilebhu yomgangatho we-NBJGE.