Indlela Ukubekezelelana Kwephimbo Lesixhumi se-PCB Okuthinta Ngayo Ubuqotho Besignali Kuzinhlelo Zokusebenza Ezivame Kakhulu
TL;DR — Izinto Ezibalulekile Okufanele Uzicabangele
- Ukubekezelelana kwephimbo lesixhumi kunquma ngqo ubuqotho besiginali kumaza aphezulu. Ukuphambuka kwe-+/-0.05mm kungashintsha ukuvimba kwezimpawu ngama-ohm angu-5-12, okubangela amaphutha okubonakaliswa kwesiginali kanye nedatha.
- Kuzinhlelo zokusebenza ezingaphezu kwe-1 GHz, chaza ukubekezelela kwephimbo kwe-+/-0.05mm noma okungcono. Izixhumi ezijwayelekile zokubekezelela ze-+/-0.1mm zikhawulelwe ekusebenzeni kwe-sub-500 MHz.
- Ukukhetha izinto ezibalulekile kubalulekile: Ama-dielectric e-LCP andisa imikhawulo yemvamisa esebenzisekayo ngo-30-50% ngaphezu kwezixhumi ze-PA66/PA6T ezijwayelekile endaweni efanayo.
- Uchungechunge lwe-NBJGE IC Socket lunikeza izinhlobo ezintathu ze-pitch (1.27mm, 2.0mm, 2.54mm) ezinokubekezelelana okunembile kwezokuxhumana ngocingo, ukulawula kwezimboni, kanye nezinhlelo zokusebenza ze-RF.
Ukubekezelelana kwephimbo lesixhumi se-PCB kungenye yemingcele enganakwa kakhulu kodwa ebalulekile enquma ubuqotho besiginali ezinhlelweni ze-elekthronikhi ezisebenza ngesivinini esiphezulu. Uma izikhathi zokuphakama kwesignali zisondela ku-nanosecond eyodwa noma ngaphansi, ubukhulu obubonakalayo besixhumi buqala ukubusa ukuziphatha kukagesi. Onjiniyela bokuklama bekhetha izixhumi kwezokuxhumana ingqalasizinda, izinhlelo zokulawula zezimboni, noma amamojula e-RF awakwazi ukuphatha ukubekezelelana kwephimbo njengencazelo yesibili.
Ngoba ngisho nokuphambuka okubonakala kukuncane esikhaleni sokuxhumana kudala ukungaqhubeki kwe-impedance okubonisa amandla emuva emthonjeni kunokuba kuwenze atholakale kahle emthwalweni. Kuhlelo lwama-ohm angu-50 olusebenza ku-2.4 GHz, isinyathelo sokungabekezeleli kwephimbo esibangelwa ukubekezelelana kwephimbo esingu-10 ohms kuphela singakhiqiza isilinganiso samagagasi okuma kwe-voltage (VSWR) esidlula u-1.5:1, okuholela ekulahlekelweni kwamandla okungu-4% okuhlangana kuzo zonke izixhumi eziningi.
Ukuqonda i-PCB Connector Pitch kanye nendima yayo ekudlulisweni kwesignali
Iphimbo lokuxhuma — i ibanga eliphakathi nendawo phakathi koxhumana nabo abaseduze kusixhumi se-PCB noma isokhethi le-IC — ichaza i-geometry eyisisekelo yendlela yokudlulisela. Lobu bukhulu, buhlanganiswe nezakhiwo zezinto ze-dielectric kanye ne-geometry yokuxhumana, busungula i-characteristic impedance (Z0) etholwa yisignali njengoba ihamba ngesixhumanisi.
Ekwakhiweni kwe-PCB okuvamise kakhulu, umgomo uwukugcina ukuvimba okuqhubekayo kuyo yonke indlela yesiginali kusukela kumshayeli kuya kumamukeli. Noma yiluphi ushintsho olungazelelwe ku-impedance ludala ukubonakaliswa okuyingxenye. Amandla abonakalisiwe asusa esignalini ehamba phambili, anciphise ubukhulu be-receiver futhi angabangela amaphutha e-bit ezinhlelweni zedijithali.
Ubudlelwano phakathi kwephimbo lokuxhuma kanye ne-impedance bulandela inkolelo-mbono yomugqa wokudlulisa osungulwe kahle. Iphimbo elibanzi ngokuvamile likhiqiza i-impedance ephezulu ye-geometry yokuxhumana ethile, kuyilapho iphimbo elincane linciphisa i-impedance ngokwandisa ukuxhumanisa kwe-capacitive phakathi kwabaqhubi abaseduze.
Kungani Ukubekezelelana Kwephimbo Kuyipharamitha Ebalulekile — Akuyona Iphimbo Kuphela
Amanani e-nominal pitch (2.54mm, 2.0mm, 1.27mm) ahlinzeka nge-geometry eqondiwe, kodwa ukubekezelelana kokukhiqiza kunquma ukuthi lelo geometry ligcinwa njalo kangakanani kuwo wonke amanani okukhiqiza. Isixhumi esichazwe ku-pitch engu-2.54mm kodwa esenziwe ngokubekezelelana kwe-+/-0.15mm sizobonisa ukwehluka okukhulu kokungaguquguquki kusuka ku-pin kuya ku-pin kanye nokusuka ku-batch kuya ku-batch.
Ngenxa yokuthi i-impedance ilingana ngokuphambene nesikhala esiphakathi kwabaqhubi besiginali nababuyayo, ukushintshashintsha kwe-+/-0.1mm ku-pitch kungakhiqiza ukushintshashintsha kwe-impedance okungu-+/-4 kuya ku-+/-8 ohms ekucushweni kwe-microstrip okuvamile okungu-50 ohm. Uma lokhu kuhlukahluka kufinyelela ku-+/-12 ohms noma ngaphezulu — okuvamile ngezixhumi zezinga eliphansi — ukunqamuka kokungaqhubeki kwe-impedance kuba kubi ngokwanele ukwehlisa ikhwalithi yesignali ngisho nakumaza aphakathi.
| Ukubekezelelana (+/-mm) | Ukuguquguquka kwe-Impedance (+/-ohms) | Imvamisa Esebenziseka Kakhulu (GHz) | Isicelo Esijwayelekile |
|---|---|---|---|
| +/-0.15 | 8-12 | 0.3 | I/O enesivinini esiphansi, izixhumi zamandla |
| +/-0.10 | 5-8 | 0.8 | Isiginali yenhloso ejwayelekile, ukulawula kwezimboni |
| +/-0.05 | 3-5 | 3.0 | I-Gigabit Ethernet, amakhadi e-telecom line |
| +/-0.03 | 1-3 | 10.0 | Amamojula e-RF, ingqalasizinda ye-5G |
Yingakho ukucacisa ukubekezelela iphimbo kuhlukanisa imiklamo emikhulu yemvamisa ephezulu nezindlela ezisezingeni lokuzijabulisa. Isigaba sokubekezelelana se-+/-0.05mm esitholakala kuma-socket e-NBJGE acacile e-IC simelela umkhawulo osebenzayo wokusebenza okuthembekile ngaphezu kwe-1 GHz.
Ukuqhathaniswa kwe-IC Socket Pitch: 1.27mm vs 2.0mm vs 2.54mm
Umugqa womkhiqizo we-socket ye-IC ye-NBJGE uhlanganisa izinhlobo ezintathu ze-pitch ezijwayelekile, ngayinye ilungiselelwe izizinda ezahlukene zesicelo se-high-frequency. Ngokusekelwe ekulinganisweni kwe-TDR yasefektri okwenziwe ku-Q1 2026 kumasampula angaphezu kuka-200, ukuqhathanisa okulandelayo kubonisa amapharamitha obuqotho besignali alinganisiwe ekilasini ngalinye le-pitch.
| Ipharamitha | Iphimbo elingu-1.27mm | Iphimbo elingu-2.0mm | Iphimbo elingu-2.54mm |
|---|---|---|---|
| Ukubekezelelana Okujwayelekile | +/-0.05mm | +/-0.05mm | +/-0.10mm (std) / +/-0.05mm (iprimiyamu) |
| Impedance Eyingqayizivele | 42+/-5 ohms | 48+/-4 ohms | 52+/-5 ohms |
| Ukulahlekelwa Kokufakwa (ku-3 GHz) | -0.8 dB | -0.6 dB | -0.5 dB |
| I-Crosstalk (ku-2 GHz, amaphini aseduze) | -22 dB | -28 dB | -32 dB |
| I-Bandwidth Esebenzisekayo (-3 dB) | 2.5 GHz | 4.0 GHz | 5.5 GHz |
| Ubuningi bephini (amaphini nge-cm2 ngayinye) | 62 | 25 | 15 |
| Isicelo Esingcono Kakhulu | Ibhasi ledijithali elinabantu abaningi | Izinhlelo zesignali ezixubile | I-RF / i-analog yemvamisa ephezulu |
Izilinganiso zethu zembula ukuhweba okucacile: iphimbo elincane linikeza ukuminyana okuphezulu kwephini kodwa lethula i-crosstalk ephezulu kanye ne-impedance ephansi, kokubili okwehlisa ukusebenza kwemvamisa ephezulu. Uhlobo lwe-pitch engu-2.54mm, olune-crosstalk yalo ephansi (-32 dB vs -22 dB ye-1.27mm) futhi luhambisana kakhulu ne-impedance yesistimu engu-50 ohm, luhlala ludlula izixhumi ze-pitch ezinhle kakhulu kuzinhlelo zokusebenza ze-analog RF ezingaphezu kwe-1 GHz.
Lokhu kuwukuqonda okubalulekile konjiniyela bokuklama: lapho ubuqotho besiginali bubaluleke kakhulu, ungasebenzisi iphimbo elincane kakhulu elitholakalayo ukuze wonge isikhala. Isokhethi ye-IC yephimbo engu-2.54mm ihlala iyisinqumo esikhethwayo kuma-interface amaningi e-RF kanye nezokuxhumana afinyelela ku-5 GHz.
Indlela Ukubekezelelana Kokukhiqiza Okudala Ngayo Ukungaqhubeki Kwe-Impedance
Izici ezintathu zokukhiqiza ezithile zihumusha ukubekezelelana kwephimbo kube ukuwohloka kwesiginali okulinganiselwe: iphutha lokubeka ukuxhumana, ukushintshashintsha kobukhulu be-insulator, kanye nokungalingani kobukhulu be-plating.
Indlela yembangela #1: Ngenxa yokuthi iphutha lokubeka othintana naye ngesikhathi senqubo yokubumba nokufaka lidala isikhala esingalingani phakathi kothintana naye wesignali oseduze, ubude be-capacitance ngeyunithi bushintsha kusuka ku-pin kuya ku-pin. Lokhu kuhlukahluka kwe-capacitance okusendaweni kukhiqiza ukuguquguquka kwe-impedance okuhambisanayo endaweni ngayinye yokuxhumana. Ku-2.4 GHz, iphutha le-pitch elingu-0.08mm phakathi kwama-pin amabili aseduze lidala ushintsho lwe-capacitance olucishe lube ngu-0.15 pF, oluhambisana nesinyathelo se-impedance esingu-7 ohms.
Indlela yembangela #2: Ngenxa yokuthi izinto zokwakha i-insulator (ngokuvamile i-PA66, i-PA6T, noma i-LCP) zincipha ngo-0.2-1.5% ngesikhathi senqubo yokupholisa ngokufaka umjovo, isikhala sangempela sokuxhumana ngemva kokupholisa sihlukile kumklamo womgodi wesikhunta. Isixhumi sephimbo esingu-2.54mm esibunjwe ku-PA6T esincipha ngo-0.6% sithola ukwehliswa kwephimbo okumaphakathi okungu-0.015mm. Uma kuhlanganiswa nokuguguleka kwamathuluzi, ukwehluka kwezinga lokushisa, kanye nokwehluka kweqembu lezinto, ukubekezelelana okuhlanganisiwe kungafinyelela ku-0.10-0.15mm.
Indlela yembangela #3: Ngoba ukukhetha igolide elicwebezelayo (ngokuvamile 0.76-1.27 um phezu kwesithiyo se-nickel) sinezela u-15-25 um wezinto ezibonakalayo ngobuso bokuxhumana, ukwehluka kobukhulu be-plating kulo lonke umugqa wokuxhuma kudala izinguquko ezincane kodwa ezilinganiswayo zephimbo. Imigqa ye-plating ekhethiwe ngesivinini esikhulu enokuqapha kobukhulu be-XRF ngesikhathi sangempela ibamba lokhu kwehluka ku-+/-3 um, kuyilapho izinqubo ezijwayelekile zingase zivumele u-+/-8 um.
Indima Yezinto Ezisebenza Ngogesi Ekusebenzeni Okukhulu Kakhulu
Izinto zokuvikela ezizungeze oxhumana nabo besixhumi se-PCB zinomthelela omkhulu ekuqineni kwesiginali — ngisho nangaphezu kokubekezelela iphimbo kwezinye izimo. I-dielectric constant (Dk) kanye ne-dissipation factor (Df) yezinto zokwakha zinquma ukuthi insimu ye-electromagnetic iziphatha kanjani esixhumini esibonakalayo.
| Izinto | I-Dk ku-1 GHz | I-Df ku-1 GHz | Izinga lokushisa eliphezulu (C) | Izindleko Ezihlobene |
|---|---|---|---|---|
| I-PA66 (inayiloni ejwayelekile) | 3.5-4.0 | 0.020-0.030 | 120 | 1.0x |
| I-PA6T (inayiloni eshisa kakhulu) | 3.3-3.8 | 0.010-0.018 | 180 | 1.4x |
| I-PPS (i-polyphenylene sulfide) | 3.0-3.5 | 0.004-0.008 | 220 | 1.8x |
| I-LCP (i-polymer yekristalu ewuketshezi) | 2.8-3.3 | 0.002-0.005 | 260 | 2.5x |
Ama-dielectric e-LCP yandisa ububanzi bemvamisa esebenzisekayo yomklamo wephimbo onikeziwe ngo-30-50% uma kuqhathaniswa nezindlu ezijwayelekile ze-PA66, ikakhulukazi ngenxa ye-LCP's dielectric constant ephansi futhi ezinzile kanye ne-dissipation factor ephansi kakhulu. Kwisokhethi ye-IC yephimbo engu-2.54mm esebenza ku-3.5 GHz, i-LCP housing inciphisa ukulahlekelwa kokufakwa kusuka cishe ku--0.9 dB kuya ku--0.5 dB — ukuthuthuka okungu-44%.
I-NBJGE inikeza izinketho ze-dielectric ze-LCP kanye ne-PPS kulo lonke uhla lomkhiqizo wayo we-socket ye-IC kumakhasimende anezinhlelo zokusebenza ezidinga ubuqotho obukhulu besignali kumaza angaphezu kwe-2 GHz.
Ukuwohloka Kobuqotho Besignali: Kusukela Kumbono Kuya Kumthelela Ongalinganiswa
Ukuwohloka kwesignali okubangelwa ukubekezelelana kwephimbo kubonakala ngezindlela ezintathu ezilinganiswayo: ukulahlekelwa okwandayo kokubuya, i-crosstalk ephezulu, kanye nokuqongelela kwe-jitter emifudlaneni yedatha yedijithali.
Ukulahleka kokubuya — okulinganiswe njenge-S11 ku-dB — kulinganisa ukuthi ingakanani isibonakaliso sesigameko esibonakala emuva ngenxa yokungafani kwe-impedance. Kwisixhumi esisebenza ku-3 GHz esinokubekezelelana kwe-+/-0.10mm, isilinganiso esijwayelekile sokulahlekelwa ukubuya -12 kuya ku-15 dB, okusho ukuthi kuboniswa amandla esignali angu-3-6%. Ukuthuthukisa ukubekezelelana kwe-+/-0.05mm kuthuthukisa ukulahlekelwa ukubuya ku--18 kuya ku-22 dB, kunciphisa amandla abonakalayo ku-0.6-1.5%.
I-Crosstalk — elinganiswa njenge-S21 (eduze kokuphela) noma i-S31 (kude kokuphela) — ilinganisa ukuhlangana okungafuneki phakathi kwezindlela zesignali eziseduze. Ku-2 GHz, isixhumi sephimbo esingu-1.27mm sibonisa cishe i-crosstalk engu-10 dB ngaphezulu kunesixhumi sephimbo esingu-2.54mm ekucushweni okufanayo.
Ukuqongelela kwe-Jitter — ukushintshashintsha kwesikhathi kokushintsha kwesignali yedijithali — mhlawumbe kungumphumela obaluleke kakhulu ekusebenzeni ngoba kunciphisa ngqo i-timing margin kuma-receiver edijithali. Ukungafani kwe-impedance okubangelwa yisixhumi esingu-10 ohms ngesilinganiso sedatha esingu-1.25 Gbps kudala cishe ama-25-40 ps we-deterministic jitter. Uma kukhona izixhumi ezintathu noma ezine endleleni yesignali, i-jitter eqongelelekile ingadla u-30-50% wesabelomali sesikhathi seyunithi esitholakalayo.
Iziqondiso Zokukhetha Ezisebenzayo Zonjiniyela Bokuklama
Khetha isigaba sakho sokuxhuma i-PCB kanye nesigaba sokubekezelelana ngokusekelwe ku-frequency yokusebenza kuqala, bese kuba yi-pin density kanye nezindleko.
Kwezinhlelo zokusebenza ze-DC kuya ku-500 MHz
Iphimbo elijwayelekile elingu-2.54mm elinokubekezelelana okungu-+/-0.10mm lanele. Ama-dielectric e-PA66 noma e-PA6T anikeza ukusebenza okwanele. Izinhlelo zokusebenza ezijwayelekile zifaka phakathi amasignali okulawula ukuphakelwa kwamandla, izixhumi zezinzwa zezimboni, kanye nokutholwa kwedatha okusheshayo.
Kuzinhlelo zokusebenza ezisukela ku-500 MHz kuya ku-3 GHz
Khetha iphimbo elingu-2.54mm noma elingu-2.0mm elinokubekezelelana okungu-+/-0.05mm kanye ne-dielectric ye-PA6T noma ye-PPS. Cacisa i-impedance elawulwayo (50 ohms +/-5 ohms) bese ucela idatha yokuhlola ye-TDR yasefektri. Lolu hlu luhlanganisa amamojula we-Gigabit Ethernet, i-WiFi 5/6 front-end, kanye nengqalasizinda ye-4G LTE.
Izinhlelo zokusebenza eziqala ku-3 GHz kuya ku-10 GHz
Sebenzisa iphimbo elingu-2.54mm eline-+/-0.03mm tolerance kanye ne-LCP dielectric. Cela ukucaciswa okugcwele kwepharamitha ye-S kuze kufike ku-10 GHz. Lokhu kuhlanganisa izamukeli zesathelayithi ze-5G NR sub-6 GHz kanye ne-Ku-band. I-NBJGE ifinyelela ukubekezelelana kwe-+/-0.03mm ngokusebenzisa amathuluzi okubumba anembile ngokuzinzisa izinga lokushisa lamathuluzi amahora angu-48 ngesikhathi sokukhiqiza.
Ngaphezulu kwe-10 GHz
Cabanga ngezixazululo zesixhumi ezenziwe ngokwezifiso ezinezindilinga zomhlabathi ezifakiwe. Amasokhethi ajwayelekile e-IC awanconywa ngaphezu kwe-10 GHz ngaphandle kokulingisa okubanzi kwe-SI. Xhumana nethimba lethu lobunjiniyela ukuthola izincomo eziqondene nohlelo lokusebenza.
Izindlela Zokuhlola Nokuqinisekisa
I-TDR (i-reflectometry yesizinda sesikhathi) iyindlela yokuhlola eyinhloko yokuqinisekisa iphrofayili ye-impedance yesixhumi ngaphansi kwezimo zokusebenza zangempela. Ithuluzi le-TDR lithumela i-pulse yesinyathelo esisheshayo (ngokuvamile isikhathi sokukhuphuka esingu-35 ps, esihambisana ne-bandwidth engu-10 GHz) futhi lilinganisa ukubonakaliswa. Ukungaqhubeki ngakunye kwe-impedance kuvela njengokukhuphuka kwesimo se-TDR.
Ukulinganiswa kwe-S-parameter ye-VNA (vector network analyzer) kunikeza ukucaciswa kwesizinda semvamisa okudingekayo ukuze kulinganiswe umklamo. Ngokwe I-IEC 60512-27-100, izilinganiso zepharamitha ye-S zezixhumi ze-PCB kufanele zenziwe okungenani ngaphezu kwemvamisa yokusebenza ephezulu ka-5.
Ukuhlaziywa kwedayagramu yamehlo kuyindlela eqondakala kakhulu yokuhlola ikhwalithi yesignali yedijithali ngokusebenzisa isixhumi. Ku-socket ye-NBJGE IC engu-2.54mm ene-+/-0.05mm yokubekezelelana, ukuhlolwa kwasefektri ku-2.5 Gbps kukhombisa ukuvulwa kwamehlo okuqondile okungu-320 mV (68% we-amplitude yomshayeli) kanye ne-jitter evundlile engu-22 ps peak-to-peak.
Ukuqhathanisa Okuncintisanayo: Izindinganiso ze-NBJGE vs Imboni
Ngenxa yokuthi akuzona zonke izisekelo ze-IC "ezinembile" ezinikeza ukusebenza okufanayo kokubekezelelana, siqhathanise ngqo izigaba ezintathu zabahlinzeki ku-pitch engu-2.54mm sisebenzisa idatha yokuhlolwa kwefektri evela kumasampula angama-50-piece.
| Ipharamitha | Ukunemba kwe-NBJGE | Izinga Lemboni | Ibanga Lesabelomali |
|---|---|---|---|
| Ukubekezelelana Okulinganisiwe (ama-sigma angu-6) | +/-0.05mm | +/-0.10mm | +/-0.15mm |
| I-TDR Impedance (ithagethi engu-50 ohm) | 52+/-4 ohms | 49+/-8 ohms | 50+/-12 ohms |
| Ukulahlekelwa Kokufakwa ku-3 GHz | -0.5 dB | -0.8 dB | -1.4 dB |
| Ukulahlekelwa Kokubuyiselwa ku-3 GHz | -20 dB | -14 dB | -9 dB |
| Ukuqina Okuncane Kwegolide Lokugoqa Igolide | 0.76 eyodwa | 0.50 eyodwa | 0.25 eyodwa |
| Inkomba Yentengo | 1.0x | 0.7x | 0.4x |
Isiphetho Nezinyathelo Ezilandelayo
Ukubekezelelana kwephimbo lesixhumi se-PCB kuyipharamitha yokuklama ye-oda lokuqala yobuqotho besignali yemvamisa ephezulu, hhayi incazelo yesibili yokukhiqiza. Umehluko phakathi kokubekezelelana kwe-+/-0.10mm kanye ne-+/-0.05mm ungasho umehluko phakathi komdwebo weso odlulayo nowokwehluleka ku-3 GHz, ohumusha ngqo ekuthembekeni kwensimu kwezokuxhumana kanye nemishini yokulawula yezimboni.
Uma uhlola abahlinzeki bezixhumi ze-PCB ngomklamo wakho olandelayo wemvamisa ephezulu, cela idatha ethile yokubekezelelana enezilinganiso ze-TDR impedance kunokuthembela ezicacisweni zephimbo elijwayelekile kuphela.
I-NBJGE inikeza imibiko yokuhlola ubuqotho besignali enemininingwane ngayo yonke ikhithi yesampula yesokhethi ye-IC, kufaka phakathi amaphrofayili e-impedance ye-TDR kanye nedatha yepharamitha ye-S efinyelela ku-10 GHz.
Udinga Amasokhethi E-IC Aqondile Ukuze Uklame I-High-frequency Design Yakho?
Cela ikhithi yesampula yamahhala ngedatha ephelele yokuhlola ubuqotho besiginali.
Vakashela: Umugqa Womkhiqizo Wesokhethi ye-NBJGE IC
I-imeyili: sara@nbjguang.com | Ucingo: +86-15957487380
imibuzo ejwayelekile ukubuzwa
Ngingayisebenzisa yini i-1.27mm pitch connector kuzinhlelo zokusebenza ze-5G?
Yebo, kodwa ngokucabanga ngokucophelela ngokuklama. Isixhumi sephimbo esingu-1.27mm singasetshenziswa ku-5G NR sub-6 GHz uma umklamo uhlanganisa ukuvikela phansi kanye nemvamisa ihlala ngaphansi kwe-3 GHz. Ngaphezu kwe-3 GHz, i-crosstalk ephezulu (-22 dB) kanye ne-impedance ephansi (42 ohms) kungabangela ukuwohloka kwesignali okungamukeleki.
Kufanele ngiqinisekise kangaki ukubekezelelana kwephimbo lokuxhuma ekukhiqizweni?
Ukuhlolwa kwekhwalithi yabahlinzeki kufanele kufake phakathi ukulinganiswa kwephimbo njalo ezinyangeni ezi-6. Ngokwe I-ISO 9001 Uma udinga ulwazi oludingekayo, cela idatha yokulinganisa ye-AOI kusukela ezinyangeni ezingu-12 zokugcina zokukhiqiza ngamanani e-Cpk angaphezu kuka-1.33.
Ingabe izinguquko zokushisa zithinta ukubekezelelana kwephimbo?
Yebo, ukwanda kokushisa kuthinta iphimbo lesixhumi esisebenzayo. Isixhumi se-LCP esingu-2.54mm pitch (CTE esingu-5-10 ppm/C) sanda cishe ngo-0.0013mm ngokukhuphuka okungu-10 C. Ukwanda okuqongelelekayo kusixhumi esine-pin engu-64 kungafinyelela ku-0.08mm ngokuhluka kokushisa okungu-50 C. Ngezinhlelo zokusebenza ezibanzi zokushisa, chaza izinto ezihambisana ne-CTE.
Izinkomba: I-ISO 9001:2015 | I-IEC 60512-27-100 | Izindinganiso Zobuqotho Besignali ze-IEEE
Kugcine ukubuyekezwa: 21 Meyi 2026. Idatha esekelwe ezilinganisweni zasefektri zekota yokuqala ka-2026 ezivela kumasampula e-socket e-IC angaphezu kuka-200 elabhorethri yekhwalithi ye-NBJGE.