Ngisebenza ekucacisweni kwebhulokhi yesiphelo kanye nokusekelwa ku- J-GUANG, futhi ngichitha ingxenye enkulu yesikhathi sami ngiphendula imibuzo yokwakheka kwe-PCB evela konjiniyela bokuklama abahlanganisa ibhulokhi yethu yesikulufo se-301-5.0 emabhodini okusabalalisa amandla. Imibuzo engiyibuzayo ayimayelana nemininingwane yebhulokhi ye-terminal ngokwayo - leyo ikwidathabhethi. Imayelana nokuhlanganiswa kwemishini: ukuthi amabhulokhi aseduze angabekwa eduze kangakanani, ukuthi usayizi wokubhoboza unikeza ukuthembeka okungcono kakhulu kwejoyinti le-solder, nokuthi kwenzekani endlini ye-PA66 uma idlula ebhavini le-solder lamagagasi angu-260°C imizuzwana engu-8. Lesi sihloko siqoqa izimpendulo engizitholile kusukela kumaqoqo ayi-12 okuhlolwa kwezimfanelo zamakhasimende esikwenzile phakathi kuka-2023 no-2025.

Ubukhulu Bezinyathelo Ze-PCB: Lokho Okuboniswa Yi-Datasheet Uma kuqhathaniswa Nokusebenza Ekukhiqizeni

I-301-5.0 isebenzisa iphimbo lephini elingu-5.0 mm, okuyindinganiso yalolu hlobo lwe- ibhulokhi yesiphelo. Ubukhulu bephini buyithusi elingunxande elingu-1.0 x 1.2 mm eline-tin plating. Usayizi wembobo ye-PCB onconywayo ububanzi obuqediwe obungu-1.3-1.5 mm — ububanzi obanele ukuvumela iphini ukuthi izimele phakathi ngesikhathi sokugoqa ngamagagasi kodwa iqine ngokwanele ukuqinisekisa ukuthi isenzo se-capillary sidonsa i-solder emgodini. Ekuhlolweni kwethu kokuthembeka kwejoyinti le-solder kumasampula angu-500, imbobo engu-1.4 mm ikhiqize amandla aphezulu okudonsa aphakathi ku-35 N okungenani angu-28 N. Imbobo engu-1.6 mm inciphise amandla okudonsa aphakathi ku-29 N ngoba igebe le-capillary lalibanzi kakhulu ukuze kugcwaliswe i-solder njalo.

Imininingwane eyodwa engekho kudathashethi kodwa ebalulekile ekukhiqizweni: ukuvuleka kwephini kuya embobeni kuyashintsha ngobukhulu be-PCB. Ebhodini elijwayelekile le-FR-4 elingu-1.6 mm, imbobo engu-1.4 mm enephini engu-1.2 mm inikeza ukuvuleka kwe-diametral okungu-0.2 mm, okuyinto engcono kakhulu. Ebhodini elingu-2.4 mm lezinhlelo zokusebenza zamandla aphezulu, ukuvuleka okufanayo kusasebenza kodwa isikhathi sokuhlala kwe-wave solder kumele sande kusukela kumasekhondi angu-3 kuya kumasekhondi angu-5 ukuqinisekisa ukugcwaliswa kwembobo egcwele. Sinesethi yamapharamitha e-wave solder anconywayo ngobukhulu bebhodi engiwathumela kuwo wonke amakhasimende okuqala.

Ukususwa Kwemishini Ezungeze Ibhulokhi Yesiphetho ku-PCB

I-301-5.0 ilinganiselwa ku-10.0 mm ukuphakama kusukela ebusweni be-PCB kuya phezulu kwendlu. Isikulufu sokubopha sidinga ukufinyelela kwesikulufu kusuka phezulu, futhi isikhala sesikulufu sibekwe eceleni ngo-2.5 ​​mm endlini. Uma ufaka izintambo ngesandla, lokhu kusho ukuthi kufanele kube nesikhala esincane esingu-15 mm ngaphezu kwe-PCB ukuze kufakwe isikulufu esijwayelekile esingu-3.0 mm esiyisicaba ekhoneni lokufakwa elingu-15 degrees. Uma ufaka isikulufu ngokuzenzakalelayo ekukhiqizeni, isidingo sokuphuma sikhuphukela ku-20 mm ukuze kufakwe isibambi se-screwdriver bit.

Phakathi kwamabhulokhi asezindaweni eziseduze, ngincoma ukuthi kube nesikhala esincane esingu-2.0 mm ukusuka onqenqemeni lwendlu kuya engxenyeni elandelayo. Indlu inobubanzi obungu-8.5 mm ngesikhundla sensika, ngakho-ke ngephimbo elingu-5.0 mm igebe eliphakathi kwezindonga zendlu eziseduze lingu-8.5 - 5.0 = 3.5 mm. Lelo gebe elingu-3.5 mm lanele ezindaweni eziningi zokukhiqiza, kodwa uma ibhodi lidlula embozweni oqondile, i-nozzle yokufaka iphimbo ngokuvamile idinga isikhala esingu-5.0 mm. Sasinomthengi oyedwa owathola ukuthi irobhothi labo elikhethayo lokumboza lalishaya izindonga zendlu ngesikhala esingu-3.5 mm - bashintshela empondweni ngamunye ukuze bakhe iphimbo elingu-10 mm ephasishini lokumboza base begcwalisa izikhundla zeqiwe ngesandla.

Ukuthembeka Kwejoyinti Le-Solder: Amapharamitha E-Wave Solder kanye Nedatha Yokuhlola Ukudonsa

Indlu engu-301-5.0 ibunjwe nge-PA66 ngesilinganiso se-UL94 V-0, futhi yenzelwe ukumelana nokushiswa kwamagagasi. Iphrofayili yethu ye-wave solder evunyiwe: shisa kusengaphambili i-100-120°C imizuzwana engu-60-90, izinga lokushisa eliphakeme le-solder lingu-255-260°C, isikhathi sokuhlala imizuzwana engu-3-5 kumabhodi angu-1.6 mm kanye nemizuzwana engu-5-7 kumabhodi angu-2.4 mm. Sihlole amasampula angu-500 ngale phrofayili ngo-2024 ngaphandle kokuguquguquka kwendlu.

Ukuhlolwa kokudonsa kwejoyinti le-solder kuyindlela ye-QC esiyincomayo yokuqinisekisa umugqa wokukhiqiza. Sisebenzisa i-force gauge ene-hook fixture edonsa ngokuqondile emzimbeni we-terminal block ngemuva kokugoqa. Idatha yethu evela kumasampula angu-500: amandla okudonsa aphakathi angu-35 N, ubuncane obungu-28 N, ukuphambuka okujwayelekile okungu-3.2 N. Ekukhiqizeni, ngincoma i-Cpk target engu-1.33 enomkhawulo wencazelo ophansi ongu-25 N — okusho ukuthi akukho joyinti le-solder elingaphezu kwe-1 ku-4,000 okufanele lihluleke ngaphansi kwamandla okudonsa angu-25 N. Isici esiyinhloko esisunduza amandla okudonsa ngaphansi kuka-25 N ukunganeli kwevolumu yokugcwalisa i-solder, esikuthole kuzimbangela ezimbili eziyinhloko: ububanzi bembobo ye-PCB obudlula u-1.55 mm, kanye nesilinganiso sokusetshenziswa kwe-wave solder flux esiwela ngaphansi kuka-0.3 mL ngebhodi ngenxa yama-nozzle okufutha avaliwe.

Ukuphathwa Kokushisa: Amandla Amanje Emazingeni Okushisa Aphakeme Asemkhathini

Ugesi olinganiselwe we-16A we-301-5.0 usezingeni lama-25°C, wonke ama-pole alayishwe ngasikhathi sinye. Ukususwa kwamandla kagesi kuqala ezingeni lama-40°C: silinganise ukwehla okungu-4% kumandla kagesi aqhubekayo nge-10°C ngaphezu kwama-40°C ngokusebenzisa izivivinyo zokuhlola ukushisa zangaphakathi. Ku-70°C, izinga lokushisa kwamandla kagesi eliqhubekayo lehla liye ku-14.0A. Isici esinqunyiwe akusona iphini yethusi noma i-screw clamp - ukushisa okukhiqizwa esibonakalayo se-wire-to-pin, esinokumelana kokuxhumana okulinganiselwe okungu-2.0-3.5 mOhm nge-pole ngayinye ekuhlolweni kwethu kokukhiqiza. Ku-16A, i-pole ngayinye ihlakazeka cishe ngama-0.45 W. Ebhulokini lama-pole angu-12 elilayishwe ngokugcwele ku-16A nge-pole ngayinye, ukuhlakazeka okuphelele kokushisa kungu-5.4 W okugxile endaweni engu-60 x 10 mm ku-PCB. Ngaphandle kokushisa okwanele kwe-copper plane, izinga lokushisa le-PCB ngaphansi kwe-terminal block lingakhuphuka ngama-25-35°C ngaphezu kwe-ambient.

Isixazululo silula: xhuma ama-pad angena emgodini okungenani endaweni yethusi engu-50 mm² ngenduku ngayinye ku-PCB, kusetshenziswa ithusi elingu-35 µm noma elisindayo. Ibhulokhi elinamapali angu-12 elinepali ngayinye exhunywe kuthusi elingu-50 mm² libonisa ukwenyuka kwezinga lokushisa le-PCB elingu-12°C kuphela kumthwalo oqhubekayo ongu-16A, uma kuqhathaniswa no-30°C ngaphandle kokuxhumeka kweplani yethusi.

Ukuhlolwa Kwebhodwe Eliphezulu Ngemva Kokuhlanganiswa: Okushiwo Yisilinganiso Se-AC 2000V Ekukhiqizeni

I-301-5.0 icacisiwe nge-voltage ehlala njalo ye-AC 2000V ngomzuzu phakathi kwezigxobo eziseduze. Lesi yisimo sokuhlola sohlobo ku-terminal block kuphela, hhayi ku-PCB ehlanganisiwe. Uma i-block isifakwe i-wave solder ebhodini, ukuhlolwa kwe-high-pot kumele kubhekele izinto ze-PCB (i-FR-4 ivame ukuphatha i-40 kV/mm, ngakho-ke i-1.6 mm inikeza amandla e-dielectric angu-64 kV), iphrofayili ye-solder joint, kanye nanoma yikuphi ukusalela kwe-flux ebusweni bebhodi. Ngokwesipiliyoni sethu, ukwehluleka ekukhiqizeni ukuhlolwa kwe-high-pot ku-1,500V AC cishe njalo kubangelwa ukusalela kwe-flux okuhlangana phakathi kwamalunga e-pin solder aseduze, hhayi yi-terminal block ngokwayo. Sincoma ukucacisa ukusalela okungahlanzekile okunokumelana kokufakwa kokushisa kobuso okungenani okungu-10¹¹ Ohm ku-85°C kanye nomswakama ongu-85% nge-IPC J-STD-001, futhi kudinga ukuhlolwa okubonakalayo kwezindawo eziphakathi kwe-pin ngaphambi kokuhlolwa kwe-high-pot.

Ngezinhlelo zokusebenza ezidinga ukufakelwa okuqinisiwe — njengezinsiza zamandla zezokwelapha ngokwe-IEC 60601 — iphimbo lephini elingu-5.0 mm linikeza ibanga lokucwila elingu-4.0 mm phakathi kwezingongolo eziseduze (uhlangothi lwephini kuya kohlangothi lwephini endaweni yokuxhumanisa). Lokhu kwanele ku-voltage yokusebenza engu-250V enezinga lokungcola elingu-2 ngokwe-IEC 60947-7-4. Ku-voltage yokusebenza engu-300V, iphimbo elidingekayo lingu-5.0 mm, okusho ukuthi yonke eminye iphini kufanele ishiywe ingenamuntu ukuze kufinyelelwe iphimbo elingu-10.0 mm.

Ukuhlolwa Kokukhiqiza kanye Nokuhlolwa Kwe-QC Esikwenzayo Kuwo Wonke Amaqoqo

Iqoqo ngalinye lokukhiqiza lamabhulokhi okugcina angu-301-5.0 lidlula ezivivinyweni ezine ze-QC eziphoqelekile esikhungweni sethu ngaphambi kokuthunyelwa. Esokuqala ukuhlolwa kwe-torque: sisebenzisa i-0.4 Nm kusikulufu sokunamathisela sisebenzisa isikulufu se-torque esilinganisiwe bese sihlola ukuthi isikulufu sijikeleza ngokukhululeka ngama-degree angu-360 ngaphandle kokubopha. Esesibili ukuhlolwa kokudonsa ngentambo: sibamba intambo engu-14 AWG ku-0.4 Nm bese sidonsa ku-50 N imizuzwana eyi-10 - intambo akumele inyakaze. Esesithathu ukuhlolwa kwenkungu kasawoti kumasampula ama-5 ngezingcezu eziyi-10,000 - amahora angama-48 ku-5% NaCl ku-35°C nge-IEC 60068-2-11, ngaphandle kokugqwala okubonakalayo kuphini wethusi noma ku-screw efakwe ithini. Esesine ukuhlolwa kobukhulu ngokwe-IEC 60947-7-4 kokuhlukanisa iphini, ububanzi bendlu, nokuphakama kusetshenziswa uhlelo lokulinganisa umbono olune-±0.01 mm ngokunemba.

Ngo-2024, sahlola amaqoqo okukhiqiza angu-47 ngale nqubo futhi senqaba amaqoqo amathathu: elilodwa lokufundwa kwe-torque engaphindaphindeki esiteshini esisodwa sokuhlangana esisebenzisa okuzenzakalelayo, elinye lamaqoqo ama-pellet e-PA66 abonisa umswakama obonisa ukumuncwa komswakama ngesikhathi sokugcina, kanye nelinye lokwehluka kobukhulu ekuphakameni kwephini okubangelwa idayisi yokunyathela egugile. Zonke izinkinga ezintathu zalungiswa ngaphambi kweqoqo elilandelayo lokukhiqiza.

Ukuhlolwa Kwe-Torque kanye Nedatha Yokuthembeka Kokuxhumeka

Isikulufu sokubambelela ku-301-5.0 siyinsimbi ye-M2.6 esinomphelo we-zinc-plated. Ekuhlolweni kwethu kwe-torque yokukhiqiza, sisebenzisa i-0.4 Nm futhi sihlola izimo ezintathu: isikulufu sijikeleza ngokukhululeka ngama-degree angu-360 ngaphandle kokubopha, ingcindezi yokubambelela ifinyelela okungenani ku-20 N entanjeni, futhi ikhanda lesikulufu alikhumuli. Idatha yethu yango-2024 evela kumaqoqo angu-47 ibonise i-torque yokusebenza ephakathi engu-0.38 Nm ngokuphambuka okujwayelekile okungu-0.03 Nm. Awekho amasampula ahlulekile emkhawulweni we-0.4 Nm.

Kuma-oda aphindaphindayo adlula izingcezu ezingu-5,000 ngenyanga, senza ukujikeleza kokushisa kumasampula ayi-10 njalo ngenyanga: imijikelezo engu-500 kusukela ku--40°C kuya ku-+110°C. Indlu ye-PA66 ine-CTE engu-80 x 10⁻⁶ /°C uma kuqhathaniswa no-17 x 10⁻⁶ /°C wephini yethusi. Ukwandiswa komehluko ku--40°C kudala igebe elingu-0.02 mm ngaphakathi kokubekezelelana komklamo okungu-0.05 mm. Izindinganiso zokuphepha ze-electrotechnical zomhlaba wonke zigcinwa yi i-IEC. Ushintsho olumaphakathi lwamandla okubopha ngemva kwemijikelezo engu-500 lwaluyi-6.2% kudatha yethu ka-2024.

Buka yethu ububanzi obuphelele bebhulokhi yesiphelo futhi Iphrofayela YenkampaniIzindinganiso zokuphepha ezigcinwa yi- I-IEC.

Idatha Yokuhlolwa Kokumelana Nokushiswa Kwezinto Ezivikela Ukushisa kanye Nokushiswa Kwezinto Ezivikela Ukushisa

Ukumelana nokushisa kwebhulokhi yokugcina engu-301-5.0 phakathi kwezigxobo eziseduze kuhlolwa ku-DC 500V nge-IEC 60512-3-1. Ekuhlolweni kwethu kokukhiqiza kuka-2024 kwamasampula angu-1,200 kumaqoqo angu-12, ukumelana okuncane kokushisa okurekhodiwe kwakungu-5,200 MOhm, ngesilinganiso sebhetshi esingu-8,700 MOhm. Idatha yezinto ze-PA66 ikhombisa ukumelana kwevolumu okungu-10¹⁵ Ohm·cm ku-23°C kanye no-50% RH, kodwa ukumelana kwangempela kokushisa kwebhulokhi yokugcina ehlanganisiwe kuncishiswa ukungcoliswa komhlaba okuvela enkambisweni yokukhiqiza. Sithole ukuthi i-flash yokubumba umjovo - ukubonakala kwezinto ze-PA66 ezincane kakhulu emgqeni wokuhlukanisa wesikhunta - kunganciphisa ibanga lokuhamba phakathi kwezigxobo eziseduze kusukela enanini lokuklama elingu-4.0 mm kuya ku-3.2 mm esimweni esibi kakhulu. Sisebenzise inqubo yokulungisa isikhunta epholisha umugqa wokuhlukanisa njalo ngemijikelezo engu-50,000, eyehlisa ukuphakama kwe-flash kusuka ku-0.08 mm kuya ngaphansi kuka-0.02 mm.

Ukuhlolwa kwe-voltage ebekezelela i-dielectric ku-AC 2000V ngomzuzu ngokwe-IEC 60947-7-4 akudingi ukuqhekeka noma i-flashover. Ekuhlolweni kwethu, i-voltage yokuqhekeka phakathi kwezigxobo eziseduze ekucushweni kwe-301-5.0 ngokuvamile i-AC 3,800-4,200V, enikeza umkhawulo wokuphepha cishe izikhathi ezimbili ngaphezu kwe-voltage ebekezelelayo elinganiselwe. Isici esikhawulelayo akuyona indlu ye-PA66 - enamandla e-dielectric angu-25 kV/mm - kodwa indlela yokucwila phakathi kwezikhonkwane ezimbili zethusi ezingeni lobuso be-PCB, lapho i-solder fillet inciphisa khona ibanga elisebenzayo.

Buka ububanzi obuphelele bebhulokhi yesiphelo futhi izitifiketiIzindinganiso I-IEC.

Ukuhambisana Kokushisela Nomhlangano We-PCB Ozenzakalelayo

Ibhulokhi yokugcina engu-301-5.0 yenzelwe ukugoqa amagagasi kodwa futhi iyahambisana nokugoqa okukhethiwe kanye nokugoqa ngesandla. Ngokugoqa amagagasi kumabhodi angu-1.6 mm FR-4, amapharamitha ethu anconywayo yilawa: shisa kusengaphambili i-100-120°C imizuzwana engu-60-90, izinga lokushisa lokugoqa lingu-255-260°C, isikhathi sokuhlala imizuzwana engu-3-5. Ngokugoqa okukhethiwe nge-nozzle eyodwa, isikhathi sokuhlala esinconywayo sikhuphuka sibe yimizuzwana engu-6-8 ngephini ukuqinisekisa ukugcwaliswa okwanele kwe-solder. Indlu ye-PA66 ingamelana no-260°C imizuzwana engu-10 isikhathi sokuchayeka esiphelele ngephini, okwanele kuzo zonke izinqubo ezijwayelekile zokugoqa. Ngokugoqa ngesandla, sebenzisa insimbi engu-350-380°C enesihloko esingu-2.0 mm, nciphisa isikhathi sokuxhumana sibe yimizuzwana engu-3 ngephini, bese uvumela imizuzwana eyi-10 ukupholisa phakathi kwamaphini ukuvimbela ukunqwabelana kokushisa endlini. Ngezicelo ezinomthamo omkhulu ezidlula amayunithi ayi-10,000 ngonyaka, sincoma ukupakishwa kwetheyiphu nereyeli kwebhulokhi yokugcina engu-301-5.0, okuvumela ukufakwa okuzenzakalelayo kwi-PCB ngaphambi kokugoqa ngegagasi. Ifomethi yethu yetheyiphu nereyeli ibamba izingcezu ezingama-500 ngereyeli ngayinye ene-pitch engu-12.7 mm phakathi kwamabhulokhi. Umshini wokubeka uthatha ibhulokhi ngalinye ngomzimba wendlu usebenzisa i-vacuum nozzle, ulibeke kwi-PCB, futhi amandla okugcina amaphini ku-solder paste abamba ibhulokhi endaweni ngesikhathi sokuthutha ukuya esiteshini sokugoqa ngegagasi. Amandla okukhetha nokubeka anconywayo angama-5-8 N, okwanele ukusunduza amaphini nge-paste ngaphandle kokuwagoba.

Ukukhethwa Kwezinto Ezibalulekile Nokuhambisana Nesilinganiso Sokuvutha

Indlu ye-301-5.0 ibunjwe nge-injection kusuka ku-PA66 (inayiloni 66) enesilinganiso sokusha kwe-UL94 V-0 ngobukhulu obungu-0.8 mm. Isilinganiso se-V-0 sidinga ukuthi isampula ngayinye icime zingakapheli imizuzwana eyi-10 ngemva kokususwa kwesishisi, ngaphandle kokusha okuvunyelwe. Ekuhlolweni kwethu kwangaphakathi kwamasampula ayi-100 avela ezindaweni zokukhiqiza eziyi-10, isikhathi esimaphakathi sokucisha sasiyimizuzwana engu-3.2 ngemizuzwana eyi-7. Izinto ze-PA66 ziphinde zinikeze inkomba yokulandelela eqhathanisayo (i-CTI) engu-600V nge-IEC 60112, okusho ukuthi indawo yokuhlala ingamelana ne-voltage yokulandelela engu-600V ngaphandle kokwenza indlela yekhabhoni eqhubayo. Isilinganiso se-CTI sibalulekile ekusetshenzisweni kwebhodi lokusabalalisa amandla ezindaweni ezinomswakama ophezulu lapho ukuminyana kobuso kungadala indlela yokuvuza phakathi kwezigxobo zokugcina eziseduze. Iziqu zethu zezinto ze-PA66 ezingenayo zifaka ukuhlolwa kwe-CTI kumasampula amathathu ngebhetshi ngayinye, ngomkhawulo wemininingwane okungenani ongu-575V. Ngo-2024, ibhetshi elilodwa lahluleka ku-560V futhi labuyiselwa kumhlinzeki.

Ibhulokhi yokugcina engu-301-5.0 itholakala ngezilungiselelo zezinsika ezingu-2 kuya kwezingu-12 ngebhulokhi ngayinye. Insika ngayinye igcina isilinganiso sikagesi esingu-16A 300V esifanayo kungakhathaliseki ukuthi inani lezinsika lingakanani. Amabhulokhi amaningi angafakwa eceleni kwe-PCB ukuze kudalwe ukuxhumana okukhulu kokubalwa kwezinsika, kanti iphimbo elingu-5.0 mm liqinisekisa ukuhambisana namagridi okuhlelwa kwe-PCB ajwayelekile. Kumabhodi okusabalalisa amandla adinga izinsika ezingaphezu kwezingu-12, sincoma ukusebenzisa amabhulokhi amaningi anesikhala esincane esingu-2.0 mm phakathi kwezindawo zokugcina izinsika eziseduze.

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