Ndisebenza kwiinkcukacha zebhloko yesiphelo kunye nenkxaso apha J-GUANG, kwaye ndichitha ixesha lam elininzi ndiphendula imibuzo yoyilo lwe-PCB evela kwiinjineli zoyilo ezidibanisa ibhloko yethu yesikrufu ye-301-5.0 kwiibhodi zokusasazwa kwamandla. Imibuzo endiyibuzayo ayimalunga neenkcukacha zebhloko yesiphelo ngokwazo - ezo zikwiphepha ledatha. Zimalunga nokuhlanganiswa koomatshini: ukuba iibhloko ezikufutshane zinokubekwa kufutshane kangakanani, ubungakanani bokubhola bubonelela ngokuthembeka kwejoyinti yesolder, kunye nokuba kwenzeka ntoni kwi-PA66 housing xa idlula kwibhafu yesolder yamaza engama-260°C imizuzwana esi-8. Eli nqaku liqokelela iimpendulo endiziphuhlisileyo kwiibhetshi ezili-12 zovavanyo lokufaneleka kwabathengi esilwenzileyo phakathi kowama-2023 nowama-2025.

Ubukhulu be-PCB Footprint: Oko kuboniswa yiDatasheet xa kuthelekiswa noko kusebenza kwimveliso

I-301-5.0 isebenzisa iphini yephini ye-5.0 mm, esemgangathweni kolu didi lwe ibhloko yesiphelo. Ubukhulu bephini buyi-1.0 x 1.2 mm ubhedu oluyingxande olune-tin plating. Ubungakanani bomngxuma we-PCB obucetyiswayo buyi-1.3-1.5 mm ububanzi obugqityiweyo — ububanzi obaneleyo ukuvumela iphini ukuba izinze ngaphakathi ngexesha lokunyibilikisa amaza kodwa iqine ngokwaneleyo ukuqinisekisa ukuba isenzo se-capillary sitsala i-solder ngaphakathi komngxuma. Kuvavanyo lwethu lokuthembeka kwejoyinti ye-solder kwiisampuli ezingama-500, imingxunya kwi-1.4 mm ivelise amandla aphezulu okutsala kwi-35 N ubuncinane kwi-28 N. Imingxunya kwi-1.6 mm inciphise amandla okutsala kwi-29 N kuba umsantsa we-capillary wawubanzi kakhulu ukuba ungazaliswa rhoqo nge-solder.

Inkcukacha enye engekho kwiphepha ledatha kodwa ibalulekile kwimveliso: ukuvuleka kwephini ukuya emngxunyeni kuyatshintsha ngobukhulu bePCB. Kwibhodi eqhelekileyo ye-FR-4 eyi-1.6 mm, umngxuma we-1.4 mm onephini ye-1.2 mm unika ukuvuleka kwe-diametral eyi-0.2 mm, nto leyo efanelekileyo. Kwibhodi ye-2.4 mm yezicelo zamandla aphezulu, ukuvuleka okufanayo kusasebenza kodwa ixesha lokuhlala kwe-wave solder kufuneka lande ukusuka kwimizuzwana emi-3 ukuya kwimizuzwana emi-5 ukuqinisekisa ukuzaliswa ngokupheleleyo kwemingxuma. Sineseti yeeparameter ezicetyiswayo ze-wave solder ngokobukhulu bebhodi endizithumela kumthengi ngamnye oqalayo.

Ukususwa koomatshini okujikeleze iBloko yesiphelo kwiPCB

I-301-5.0 ifikelela kwi-10.0 mm ukuphakama ukusuka kumphezulu we-PCB ukuya phezulu kwendlu. Isikrufu sokubopha sifuna ukufikelela kwisikrufu ukusuka phezulu, kwaye isithuba sesikrufu sivalwe nge-2.5 mm ngaphakathi kwendlu. Kwintambo yesandla, oku kuthetha ukuba kufuneka kususwe ubuncinci be-15 mm ngaphezu kwe-PCB ukuze kufakwe isikrufu esiqhelekileyo se-3.0 mm esisicaba kwi-engile yokufakwa kwe-15-degree. Kwi-screwdriver ezenzekelayo ekuvelisweni, imfuneko yokususwa inyuke iye kwi-20 mm ukuze kufakwe isibambi se-screwdriver bit.

Phakathi kweebhloko zesiphelo ezikufutshane, ndicebisa ukuba kubekho indawo encinci ye-2.0 mm ukusuka kumda wendlu ukuya kwinxalenye elandelayo. Indawo yokuhlala inobubanzi be-8.5 mm kwindawo nganye yepali, ngoko ke ngepitshi ye-5.0 mm, indawo ephakathi kweendonga zendlu ezikufutshane yi-8.5 - 5.0 = 3.5 mm. Loo sithuba se-3.5 mm sanele kwiindawo ezininzi zemveliso, kodwa ukuba ibhodi idlula kwi-conformal coating, i-coating applicator nozzle idla ngokufuna indawo ye-5.0 mm. Sasinomthengi omnye owafumanisa ukuba irobhothi yakhe yokubeka i-selective coating yayibetha iindonga zendlu kwindawo ye-3.5 mm - batshintshela kwi-pole nganye enabantu ukuze benze i-pitch ye-10 mm kwindawo yokubeka i-coating baze bazalise izikhundla ezithe tyaba ngesandla.

Ukuthembeka kweSolder Joint: Iiparamitha zeWave Solder kunye neDatha yoVavanyo lokuTsala

Indlu ye-301-5.0 yenziwe nge-PA66 nge-UL94 V-0 rating, kwaye yenzelwe ukumelana nokunyibilikiswa kwamaza. Iprofayili yethu ye-wave solder evunyiweyo: fudumeza kwangaphambili i-100-120°C imizuzwana engama-60-90, ubushushu be-peak solder buyi-255-260°C, ixesha lokuhlala imizuzwana emi-3-5 kwiibhodi ze-1.6 mm kunye nemizuzwana emi-5-7 kwiibhodi ze-2.4 mm. Sivavanye iisampulu ezingama-500 ngale profayili ngo-2024 kungekho monakalo wendlu.

Uvavanyo lokutsala ijoyinti yesolder yindlela ye-QC esiyicebisayo yokuqinisekisa umgca wemveliso. Sisebenzisa i-force gauge ene-hook fixture etsala ngokuthe nkqo emzimbeni we-terminal block emva kokutywina. Idatha yethu evela kwiisampulu ezingama-500: amandla okutsala aphakathi angama-35 N, ubuncinci angama-28 N, ukuphambuka okuqhelekileyo okungu-3.2 N. Kwimveliso, ndicebisa ithagethi ye-Cpk eyi-1.33 enomda weenkcukacha ophantsi ongu-25 N — oko kuthetha ukuba akukho joyinti yesolder engaphezulu kwe-1 kwi-4,000 ekufuneka ingaphumeleli ngaphantsi kwamandla okutsala angama-25 N. Into ephambili etyhala amandla okutsala ngaphantsi kwama-25 N kukungabi namandla okugcwalisa i-solder, esikufumene kwizizathu ezibini eziphambili: ububanzi be-PCB bomngxuma obungaphezulu kwe-1.55 mm, kunye nesantya sokusetyenziswa kwe-wave solder flux esihla ngaphantsi kwe-0.3 mL ngebhodi ngenxa yemilomo yokutshiza evalekileyo.

Ulawulo lobushushu: Umthamo wangoku kumaqondo obushushu aphezulu angqongileyo

Umbane olinganisiweyo we-16A we-301-5.0 ukwi-25°C ambient kwaye zonke iipali zilayishwe ngaxeshanye. Ukususwa kwamandla okuqala kwi-40°C ambient: silinganise ukwehla kwe-4% kumthamo wamandla oqhubekayo nge-10°C ngaphezulu kwe-40°C ngovavanyo lomfanekiso wobushushu lwangaphakathi. Kwi-70°C ambient, umlinganiselo wamandla oqhubekayo uyehla uye kwi-14.0A. Into ethintelayo ayisiyo iphini yobhedu okanye i-screw clamp - bubushushu obuveliswa kwi-interface ye-wire-to-pin, enokumelana okulinganiselweyo koqhagamshelwano kwe-2.0-3.5 mOhm ngepali nganye kuvavanyo lwethu lwemveliso. Kwi-16A, ipali nganye isasazeka malunga ne-0.45 W. Kwibhloko yeepali ezili-12 elayishwe ngokupheleleyo kwi-16A ngepali nganye, ukuchithwa kobushushu okupheleleyo yi-5.4 W exineneyo kwindawo engama-60 x 10 mm kwi-PCB. Ngaphandle kokutshisa okwaneleyo kwe-copper plane heat, ubushushu be-PCB phantsi kwebhloko yesiphelo bunokunyuka ngama-25-35°C ngaphezu kwe-ambient.

Isisombululo silula: qhagamshela ii-pads eziphuma kwimingxunya ukuya kwi-50 mm² yendawo yobhedu ubuncinane kwipali nganye kwi-PCB, kusetyenziswa i-35 µm okanye ithusi elinzima. Ibhloko yeepali ezili-12 enepali nganye eqhagamshelwe kwi-50 mm² copper ibonisa ukunyuka kobushushu be-PCB ye-12°C kuphela kumthwalo oqhubekayo we-16A, xa kuthelekiswa ne-30°C ngaphandle koqhagamshelo lweplani yethusi.

Uvavanyo lweHigh-Pot Emva kokuhlanganiswa: Oko kuthethwa yi-AC 2000V Rating kwiMveliso

I-301-5.0 ichazwe nge-voltage engaguqukiyo ye-AC 2000V ngomzuzu phakathi kweepali ezikufutshane. Olu luhlobo lovavanyo olukwibhloko yesiphelo kuphela, kungekhona kwi-PCB edibeneyo. Nje ukuba ibhloko ifakwe kwi-wave solder ebhodini, uvavanyo lwe-high-pot kufuneka luqwalasele izinto ze-PCB (i-FR-4 idla ngokuphatha i-40 kV/mm, ngoko ke i-1.6 mm inika amandla e-dielectric angama-64 kV), iprofayili yejoyinti ye-solder, kunye nayo nayiphi na intsalela ye-flux kumphezulu webhodi. Ngokwamava ethu, ukungaphumeleli kwimveliso uvavanyo lwe-high-pot kwi-1,500V AC phantse kubangelwa kukudibana kwe-flux residue phakathi kwamalungu e-pin solder akufutshane, kungekhona yibhloko yesiphelo ngokwayo. Sicebisa ukucacisa i-flux engacocekanga enokumelana nokugquma komphezulu okuncinci kwe-10¹¹ Ohm kwi-85°C kunye ne-85% yomswakama ohambelanayo kwi-IPC J-STD-001 nganye, kwaye ifuna ukuhlolwa ngokubonakalayo kweendawo eziphakathi kwe-pin ngaphambi kovavanyo lwe-high-pot.

Kwizicelo ezifuna ubushushu obuqinisiweyo — ezifana nezixhobo zamandla zonyango ngokwe-IEC 60601 — iphini yephini ye-5.0 mm inika umgama we-4.0 mm wokuqhekeka phakathi kweepali ezikufutshane (umphetho wephini ukuya kumphetho wephini kwindawo yokudibanisa). Oku kwanele kwi-voltage yokusebenza ye-250V eneqondo lokungcola eli-2 ngokwe-IEC 60947-7-4. Kwi-voltage yokusebenza ye-300V, iphini efunekayo yi-5.0 mm, oko kuthetha ukuba zonke ezinye iiphini kufuneka zishiywe zingenamntu ukuze kufikelelwe kwiphini ye-10.0 mm.

Uhlolo lweMveliso kunye novavanyo lwe-QC esilwenzayo kwiBatch nganye

Ibhetshi nganye yemveliso yeebhloko zesiphelo ezingama-301-5.0 idlula kwiimvavanyo ezine ze-QC ezinyanzelekileyo kwiziko lethu ngaphambi kokuba zithunyelwe. Eyokuqala luvavanyo lwe-torque: sifaka i-0.4 Nm kwisikrufu sokucinezela sisebenzisa isikrufu se-torque esilungisiweyo kwaye sijonge ukuba isikrufu sijikeleza ngokukhululekileyo kwiidigri ezingama-360 ngaphandle kokubopha. Eyesibini luvavanyo lokutsala ucingo: sibamba ucingo lwe-14 AWG kwi-0.4 Nm kwaye sitsale kwi-50 N imizuzwana eli-10 - ucingo akufuneki luhambe. Eyesithathu luvavanyo lwenkungu yetyuwa kwiisampuli ezi-5 kwiziqwenga ezili-10,000 - iiyure ezingama-48 kwi-5% ye-NaCl kwi-35°C nge-IEC 60068-2-11, ngaphandle kokubola okubonakalayo kwiphini yobhedu okanye kwisikrufu esine-tin. Eyesine luvavanyo olunomlinganiselo ngokwe-IEC 60947-7-4 wokufumana isithuba sephini, ububanzi bendlu, kunye nokuphakama kusetyenziswa inkqubo yokulinganisa umbono echanekileyo ye-±0.01 mm.

Ngowama-2024, savavanya iibhetshi zemveliso ezingama-47 ngale protocol saza sazilahla iibhetshi ezi-3: enye yokufundwa kwe-torque engaphindiyo kwisikhululo esinye sokuhlanganisa esisebenzisa ngokuzenzekelayo, enye yebhetshi yeepellets ze-PA66 ezibonisa inkungu ebonisa ukufunxwa komswakama ngexesha lokugcina, kunye nenye yokwahluka kobukhulu bokuphakama kwephini okubangelwa yidayi yokunyathela egugileyo. Zonke ezi ngxaki zintathu zalungiswa ngaphambi kwebhetshi elandelayo yemveliso.

Uvavanyo lweTorque kunye neDatha yoKuthembeka koQhagamshelo

Isikrufu sokucinezela kwi-301-5.0 sisisinyithi se-M2.6 esine-zinc-plated finish. Kuvavanyo lwethu lwe-torque yemveliso, sisebenzisa i-0.4 Nm kwaye sijonga iimeko ezintathu: isikrufu sijikeleza ngokukhululekileyo kwiidigri ezingama-360 ngaphandle kokubopha, uxinzelelo lokucinezela lufikelela ubuncinci kwi-20 N kwintambo, kwaye intloko yesikrufu ayisuki. Idatha yethu yowama-2024 evela kwiibhetshi ezingama-47 ibonise i-torque ephakathi yokusebenza ye-0.38 Nm kunye nokuphambuka okuqhelekileyo kwe-0.03 Nm. Akukho sampuli ziphumeleleyo kumda we-0.4 Nm.

Kwiiodolo eziphindaphindayo ezidlula iziqwenga ezingama-5,000 ngenyanga, senza umjikelo wobushushu kwiisampuli ezili-10 ngenyanga: imijikelo engama-500 ukusuka kwi--40°C ukuya kwi-+110°C. Indlu ye-PA66 ine-CTE engama-80 x 10⁻⁶ /°C xa ithelekiswa ne-17 x 10⁻⁶ /°C yephini yobhedu. Ukwandiswa komahluko kwi--40°C kudala umsantsa we-0.02 mm ngaphakathi kokunyamezelana koyilo lwe-0.05 mm. Imigangatho yokhuseleko ye-electrotechnical yamazwe ngamazwe igcinwa yi i-IECUtshintsho oluphakathi lwamandla e-clamp emva kwemijikelo engama-500 yayiyi-6.2% kwidatha yethu ka-2024.

Jonga yethu uluhlu olupheleleyo lweebhloko zesiphelo kwaye Iprofayile yekhampaniImigangatho yokhuseleko egcinwa yi I-IEC.

Idatha yoVavanyo lweDielectric kunye ne-Insulation Resistance

Ukumelana nobushushu kwebhloko yesiphelo se-301-5.0 phakathi kweepali ezikufutshane kuvavanywa kwi-DC 500V ngokwe-IEC 60512-3-1. Kuvavanyo lwethu lwemveliso ka-2024 lweesampuli ezili-1,200 kwiibatch ezili-12, ukuthintela okuncinci kobushushu okurekhodiweyo yayiyi-5,200 MOhm, kunye nomyinge webhetshi ye-8,700 MOhm. Idatha yezinto ze-PA66 ibonisa ukumelana nomthamo we-10¹⁵ Ohm·cm kwi-23°C kunye ne-50% RH, kodwa ukumelana nobushushu bokwenyani kwibhloko yesiphelo edibeneyo kuncitshiswa kukungcola komphezulu kwenkqubo yokuvelisa. Sifumanise ukuba i-injection molding flash - ii-microscopic PA66 material protrusions kumgca wokwahlulwa kwesikhunta - inokunciphisa umgama wokuqhekeka phakathi kweepali ezikufutshane ukusuka kwixabiso loyilo le-4.0 mm ukuya kwi-3.2 mm kwimeko embi kakhulu. Sisebenzise inkqubo yokugcinwa kwesikhunta epholisha umgca wokwahlulahlula rhoqo emva kwemijikelo engama-50,000, eyanciphisa ubude befleshi ukusuka kwi-0.08 mm ukuya ngaphantsi kwe-0.02 mm.

Uvavanyo lwe-dielectric withstanding voltage kwi-AC 2000V ngomzuzu ngokwe-IEC 60947-7-4 alufuni kuqhekeka okanye ukuqhawuka. Kuvavanyo lwethu, i-voltage yokuqhekeka phakathi kweepali ezikufutshane kwisimo se-301-5.0 idla ngokuba yi-AC 3,800-4,200V, ebonelela ngomda wokhuseleko omalunga ne-2x ngaphezu kwe-voltage eqhawukileyo. Into ethintelayo asiyondlu ye-PA66 — enamandla e-dielectric angama-25 kV/mm — kodwa yindlela yokuqhekeka phakathi kweepini ezimbini zobhedu kwinqanaba lomphezulu we-PCB, apho i-solder fillet inciphisa umgama osebenzayo.

Jonga uluhlu olupheleleyo lweebhloko zesiphelo kwaye iziqinisekisoImigangatho I-IEC.

Ukuhambelana kweSoldering ne-Automated PCB Assembly

Ibhloko yesiphelo se-301-5.0 yenzelwe ukunyibilikisa amaza kodwa ikwahambelana nokunyibilikisa okukhethwayo kunye nokunyibilikisa ngesandla. Kwi-wave soldering kwiibhodi ze-1.6 mm FR-4, iiparameter zethu ezicetyiswayo zezi: fudumeza kwangaphambili i-100-120°C imizuzwana engama-60-90, ubushushu be-solder bube yi-255-260°C, ixesha lokuhlala liyimizuzwana emi-3-5. Kwi-soldering ekhethiweyo ene-nozzle enye, ixesha lokuhlala elicetyiswayo liyanda liye kwimizuzwana emi-6-8 ngephini nganye ukuqinisekisa ukuzaliswa kwe-solder okwaneleyo. Indlu ye-PA66 inokumelana ne-260°C ukuya kuthi ga kwimizuzwana eli-10 ixesha elipheleleyo lokuvezwa kwiphini nganye, elaneleyo kuzo zonke iinkqubo zokunyibilikisa ezisemgangathweni. Kwi-soldering ngesandla, sebenzisa intsimbi engama-350-380°C enencam ye-2.0 mm, nciphisa ixesha lokudibana libe yimizuzwana emi-3 ngephini nganye, kwaye uvumele imizuzwana eli-10 iphole phakathi kweephini ukuthintela ukuqokelelana kobushushu kwi-housing. Kwizicelo ezinomthamo ophezulu ezidlula iiyunithi ezili-10,000 ngonyaka, sicebisa ukupakishwa kwe-tape-and-reel kwi-terminal block ye-301-5.0, evumela ukubekwa ngokuzenzekelayo kwi-PCB ngaphambi kokudityaniswa kwamaza. Ifomathi yethu ye-tape-and-reel ibamba iziqwenga ezingama-500 nge-reel nganye kunye ne-12.7 mm pitch phakathi kweebhloko. Umatshini wokubeka uchonga ibhloko nganye ngomzimba wendlu usebenzisa i-vacuum nozzle, uyibeke kwi-PCB, kwaye amandla okugcina amaphini kwi-solder paste abamba ibhloko endaweni yayo ngexesha lokuthuthwa ukuya kwisikhululo sokudityaniswa kwamaza. Amandla okukhetha nokubeka acetyiswayo yi-5-8 N, eyaneleyo ukutyhala amaphini kwi-paste ngaphandle kokuwagoba.

Ukukhethwa kwezinto kunye nokuthotyelwa kovavanyo lokutsha

Indlu ye-301-5.0 yenziwe nge-injection-molded from PA66 (nylon 66) ene-UL94 V-0 flammability rating kubukhulu obuyi-0.8 mm. I-V-0 rating ifuna ukuba isampuli nganye icime kwimizuzwana eli-10 emva kokuba i-burner isusiwe, ngaphandle kokutsha okuvuzayo okuvunyelweyo. Kuvavanyo lwethu lwangaphakathi lweesampuli ezili-100 ezivela kwiindawo ezili-10 zemveliso, ixesha eliqhelekileyo lokucima yayiyimizuzwana eyi-3.2 kunye nobuninzi bemizuzwana esi-7. Izinto ze-PA66 zikwabonelela nge-comparative tracking index (CTI) ye-600V nge-IEC 60112, oko kuthetha ukuba umphezulu wendlu unokumelana ne-600V tracking voltage ngaphandle kokwenza indlela yekhabhoni eqhubayo. I-CTI rating ibalulekile kwizicelo zebhodi yokusasazwa kwamandla kwiindawo ezinomswakama ophezulu apho ukufuma komphezulu kunokudala indlela yokuvuza phakathi kweepali zesiphelo ezikufutshane. Isiqinisekiso sethu sezinto ze-PA66 ezizayo siquka uvavanyo lwe-CTI kwiisampuli ezintathu ngebhetshi nganye, kunye nomda weenkcukacha ongaphantsi kwe-575V. Ngowama-2024, ibhetshi enye yawa kwi-560V yaza yabuyiselwa kumthengisi.

Ibhloko yesiphelo se-301-5.0 ifumaneka ngeendlela ezimbini ukuya kwezili-12 zepali nganye. Ipali nganye igcina umlinganiselo wombane ofanayo we-16A 300V nokuba inani lilonke leepali lilonke. Iibhloko ze-multipole zinokufakelwa ecaleni kwelinye icala kwi-PCB ukwenza uqhagamshelo olukhulu lwenani leepali, kwaye i-pitch ye-5.0 mm iqinisekisa ukuhambelana neegridi ze-PCB ezisemgangathweni. Kwiibhodi zokusasazwa kwamandla ezifuna iipali ezingaphezu kwe-12, sicebisa ukusebenzisa iibhloko ezininzi ezinesithuba esincinci se-2.0 mm phakathi kwezindlu zebhloko ezikufutshane.

Imibuzo ebuzwa qho